Advances in photonic integration in data communication are being powered by the increasing demand for more bandwidth and higher channel density in systems. Devices using Photonic Integrated Circuits (PIC) require 3D-integration, creating new challenges in terms of optical fibre attachment. Optical mode matching, mechanical robustness, power stability, connector pitch, and cost-efficient assembly are just a few of the many crucial issues to be considered.
High precision alignment is key, yet the lack of standards for photonic interconnects is hampering the evolution of low-cost, generic solutions. Many challenges remain to be mastered by OEM manufacturers, suppliers, and service assemblers in their efforts to cope with the very tight tolerances involved. High-efficient coupling has to be achieved and maintained for communication and sensory devices to operate correctly.
The 2020 Photonics Packaging workshop at Fraunhofer IZM addresses this spectrum of pressing issues in the field by focusing on assembly technologies for optoelectronic and photonic integration on the board, package, and device levels.
Dr. Henning Schröder
Phone: +49 30 46403-277