Company Profiles
Optical Design:
- Development of custom optical systems according to your requirements
- Optimization of optical systems in regard to the fabrication and further requirements like costs, system size and weight
- Tolerancing of the optical systems in close cooperation with your optics manufacturer
- Optimization of the optical system under the consideration of fabrication tolerances
- Optimization of the optical system in regard to parasitic ghost reflexes and stray light
- Design of aspheres and diffractive optical elements (DOE)
- Preparation of datasheets and documentation
Simulation:
- Simulation of the optical performance of a system
- Analysis of stray light and ghost reflexes
- Sequential and non sequential ray tracing
Algorithm Development:
- Implementation of algorithms for the evaluation of measurement data. Some examples are algorithms for interferometry, phase reconstruction, image processing, feature detection, machine vision and custom algorithms for the solution of specific problems
- Implementation in C++, Python or Matlab
Electronic circuit development:
- Development of digital and analog electronic circuits.
We are specialized to develop CCD camera systems for research and industry, providing a large range of linescan camera products as well as some area cameras for almost every type of application. Also cooled cameras and complete Spectrometersystems from UV up to IR are available.
Product line card:
• Ultrasonic transducers
• Ultrasonic generators
• Transducer-Test-Systems
• Optical vibration displacement measurement systems
• Bi-directional alignment lasers
Lighting the way to customized optoelectronic solutions EPIGAP Optronic GmbH is an industrial leader in LED technology for state-of–the-art optoelectronics, which plays a key role in many industries. Our clients work in fields for industrial sensors, automation, security and safety technology, diagnostics, biotechnology and medical imaging.
Major products
• The LED chip is the starting point for any optoelectronic solution. It essentially determines the later product characteristics of the LED. EPIGAP offers high-end LED chips beginning in the deep UV range at 265 nm up to the high infrared region at 1750 nm which have a very good degradation stability and high efficiency.
• We also present point source chips with different emitting diameters and monolithic display chips especially designed with custom layouts.
• The requirements for LEDs are very different depending on the application. We realize products in a wide variety of housings, such as 3 mm, 5 mm (thru hole type), SMD or metal can. Customized housings or specially designed CoB modules for small- or medium-scale productions are also possible. We work with different materials such as FR4, ceramics or aluminum and copper based PCBs for excellent heat sink. We ensure appropriate chip deposition tolerance and use epoxy or silicon for encapsulation.
• EPIGAP traditionally offers a wide variety of photodiodes, from 150 nm in the ultraviolet up to an extended range to 2600 nm in the infrared range. These include large InGaAs photodiodes with an active area which has up to 3 mm diameter, with low dark currents and high sensitivity.
Major services
EPIGAP has its own photometric and radiometric laboratory well equipped with NIST-calibrated optical instruments to measure the electro-optic parameters of single LEDs, LED modules and photodiodes. We can accurately determine radiation pattern (viewing angle) for LEDs and reception characteristics of photodiodes. We measure parameters in visible spectral region:
- luminous intensity,
- luminous flux,
- peak or dominant wavelength,
- colour coordinates (in compliance to CIE standards)
and additional in in ultraviolet and infrared:
- radiant intensity and radiant flux (radiant power).
Degradation measurements and burn-in (in compliance to MIL standards) are performed with special test benches at different forward DC and pulse currents.
EPIGAP offers a fully integrated service from design and development to production in order to meet market requirements. Fast acting, flexibility, high-performance, high-reliability and cost-effective design make the difference for us to realize customer´s success.
Welcome to the EPIGAP-world!
F&K Physiktechnik GmbH develops and manufactures products and processes, used world wide for chip interconnection in microelectronic production. Therefore the company focus is mainly micro systems technology.
Ultrasonic generators and ultrasonic transducers for wire and (flip chip) die bonding are part of the product range. In order to set up the ultrasonic system of a bond machine in best condition special test and measurement was developed. These are the Transducer-Test-Systems (TTS-series) and the optical vibration excursion measurement systems (ODS-series). This equipment can not only be used for service purposes, but also for quality assurance. All information about the condition of the ultrasonic system of the bond machine can be feed into the quality management system. By using the test and measurement equipment preventive maintenance will be also possible.
We offer as an addition to the ultrasonic test and measurement equipment also a special designed bi-directional alignment laser for quick and easy adjustment of optical experiments and sets.
Product line card:
• Ultrasonic transducers
• Ultrasonic generators
• Transducer-Test-Systems
• Optical vibration displacement measurement systems
• Bi-directional alignment lasers
FCC FibreCableConnect GmbH develops special cables for the photonic field. We develop a design for the cable, model a prototype and manufacture the line. We manufacture single- as well as multimode fibers in the area of wave-length: 190nm-2300nm. We manufacture both single fiber cables as well as fiber bundles exclusively to the specifications of our customer.
- Fiber cables for high power transmission up to 1kW- liquide cooled.
- Fiber cables for medical laser applications: dental, urology, dermatology, surgery.
- Fiber bundles / probes - applications: spectrometry, astrophysics, sensors. Geometry of surface bundles: round, square, hexagonal, linear, etc.
- Assembling of polarization-maintaining single-mode fibers. The degree of alignment precision between 0.1 ° to 3 °.
Das Angebot der Firma ist die Durchführung von Simulationen von Belastungsszenarien in unterschiedlichen Wirtschaftsbereichen. Die Belastungen können mechanisch, thermisch oder elektromagnetisch sein. Die Ergebnisse können Verformungen, mechanische, elektro-magnetische Spannungsverteilungen, Temperaturen und weitere Ergebnisse sein. Die Rechnungen werden mit der Finite-Element-Software ANSYS (USA) ausgeführt.
Vor dem Beginn der Arbeiten wird ein Kostenangebot erstellt.
Die Ergebnisse werden ausführlich mit dem Kunden besprochen.
fibrisTerre is a provider of fiber-optic solutions for structural health monitoring. With an innovative approach to distributed strain and temperature sensing, fibrisTerre offers complete instrumentation systems to provide reliable monitoring for geotechnical engineering, industry and public infrastructure.
Finetech is a leading special machinery manufacturer providing customized equipment solutions for advanced SMD rework and micro assembly challenges. Due to their modular hardware and software architecture, the manual, semi-automated and fully-automated FINEPLACER® assembly systems offer maximum process flexibility. Available is a particularly wide spectrum of bonding technologies, including ultrasonic bonding, thermocompression bonding, adhesive technologies, and soldering in various atmospheres. Common applications are bonding of single lasers and photo diodes, laser bars, VCSEL and MOEMS, as well as the professional rework of virtually all SMD components. FINEPLACER® systems are typically at home in product and process development, prototyping and automated production environments with higher output.
First Sensor AG is one of the world's leading suppliers in the field of sensor systems. Our company develops and manufactures standardized and customized sensor solutions for applications in the Industrial, Medical and Mobility growth markets. With over 800 employees, we are represented at six German locations and also have development, production and sales sites in the USA, Canada, Singapore, China, the Netherlands, Great Britain, France, Sweden and Denmark along with a worldwide partner network. First Sensor AG is a German public limited company and has been listed in the Prime Standard of the German stock exchange in Frankfurt since 1999.
Established early 2011 FISBA Photonics GmbH is a subsidiary of FISBA OPTIK AG, a world leader in optical systems and components based in St. Gallen/Switzerland.
Located at the Science and Technology Park in Berlin-Adlershof the engineering team is fo-cused on the development of new cutting-edge laser light sources and optical microsystems. Main emphasis is placed to fiber coupled light sources in the visible light region.
