Photonics, Microelectronics

Electronic Packaging Days 2025

08:00 till 18:00
Gustav-Meyer-Allee 25, Gebäude 17/3, 13355 Berlin
Fraunhofer Institute for Reliability and Microintegration IZM
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”

 

 

The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners.

During the coffee and lunch breaks, participants will be spoilt for choice – a total of 12 IZM laboratories and the clean room will open their doors for half-hour tours. At the same time, expert sessions will offer the opportunity to talk to IZM experts about the institute's technological services and learn more about the APECS pilot line.

 

More information about the event and the programme can be found under the link below.

 

 

 

 

 

 

 

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