EuroPAT-Workshop 2024
Key topics presented
- Packaging, Assembly and Test Manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor Packaging Supply Chain
- EU Chips Act for Packaging
- CSA (Coordination and Support Action) Pack4EU Chips JU (Joint Undertaking)
- European Markets and Applications Strengths and Weaknesses
- Technology Transfer from Pilot Lines in RTO and Industrial Pilot Lines
- Collaboration in Open Advanced Packaging Piloting Facilities
Who should attend
- Managers, Directors, VPs, SVP and C-Level of
- Semiconductor Packaging, Assembly and Test industry and supply chain (Design, Materials, Equipment, Inspection, Metrology
- Business Development
- Responsible for company strategy
- Customers with demand for Packaging solutions
Highlights
- Attend the Industrial Host visit with presentations, meetings, and line tours on the afternoon of the first day.
- Participate in the full-day workshop featuring invited talks on the second day.
- Hear from high-level keynote speakers from industry and politics.
- Join the panel discussion on “The Future of Semiconductor Packaging in Europe.”
- Enjoy a Networking Dinner and other opportunities to connect with peers.
- Attend or meet participants of the IEEE Electronics System Technology Conference in the following three days at the same location.
- Visit the exhibition at IEEE Electronics System Technology Conference starting September 11, 2024.
